Packaging Thermal/Structural Analyst

Science Systems and Applications, Inc. (SSAI) is seeking Packaging Thermal/Structural Analyst candidates for a potential opportunity to support NASA at the Jet Propulsion Laboratory (JPL), a federally funded research and development center located in California. Work may be performed at JPL or customer locations, or remotely, depending on contractual and operational requirements.

This position will perform and review thermal and structural analyses of electronic hardware designs. Determine component temperatures for a variety of environments and assess random vibration fatigue life. Review analyses submitted by subcontractors to JPL projects. Support environmental test programs. Support design reviews. Interact extensively with project personnel.

Required Qualifications:

• Bachelor of Science degree in Mechanical Engineering, Aeronautical Engineering or Physics.
• Must have at least 2 years of experience in structural/thermal analysis and testing of electronic hardware and related disciplines.
• Must have some capability in thermal and structural design and analysis software such as ANSYS, ABAQUS, NX NASTRAN, and SOLIDWORKS Simulation.
• Must have some background in electronics packaging engineering, structural/thermal analysis, or manufacturing.
• Background in environmental requirements engineering and testing is desirable.